LS3D5000
LS3D5000
Loongson 3D5000 is a 32-core CPU for servers, which is packaged together by two 3C5000 silicon dies. The Loongson 3D5000 comes with 32 LA464 cores and 64MB of on-chip shared cache and supports eight-channel DDR4-3200 memory. It has five high-speed HyperTransport interfaces to connect I/O expansion bridge chips, making it possible to build a single/dual/quad-socket server system with up to 128 cores. The chip also integrates a trusted platform module (TPM). The Loongson 3D5000, measuring 75.4×58.5×6.5 mm, is packaged in a LGA-4129 socket. Its cores can run at 2.0GHz and above, with a typical power consumption of 160W and a TDP of no more than 300W. The measured scores of SPEC CPU2006 Base for single and dual-socket servers exceed 400 and 800 points, respectively, while quad-socket servers can reach a score of 1,600 points.
LS3D5000 Specification
Cores
32 LA464 cores
Frequency
≥2.0GHz
Peak computing speed
1,024GFLOPS@2.0GHz
High-speed cache
Each core includes a 64KB private L1 instruction cache and a 64KB private L1 data cache. Each core contains 256KB private L2 cache. All processor cores share a 64MB L3 cache.
Memory controller
Eight 72-bit DDR4-3200 controllers; supporting ECC
High-speed I/O
1 HyperTransport 3.0 I/O interface (DIE0_HT0)
Other I/O
1 SPI, 1 UART, 5 I2Cs, and 16 GPIO interfaces
Packaging
LGA-4129
Power management
Supporting dynamic shutdown of the clocks of main modules; supporting dynamic frequency scaling in main clock domains; supporting dynamic voltage scaling in main voltage domains
Typical power consumption
160W@2.0GHz
